The Progress of Composites with High Thermal Conductivity and Electromagnetic Shielding

Materials Physics and Chemistry

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Field Value
 
Title The Progress of Composites with High Thermal Conductivity and Electromagnetic Shielding
 
Creator Liu, Houbao
Fu, Renli
Dong, Weisong
Song, Yingjie
Zhang, Hao
 
Subject Composite Materials; High Thermal Conductivity; Electromagnetic Shielding
 
Description As electronic components develop toward high power, high package density, and device size miniaturization,  heat dissipation and electromagnetic interference between electronic components are becoming more and more serious. In order to solve the adverse elec  tromagnetic waves and heat radiation generated by electronic devices, people have high hopes for electronic packaging materials with high thermal conductivity and electromagnetic interference resistance. This paper summa  rizes the research status of high thermal conductivity composite materials and electromagnetic shielding composite materials. Finally, the latest research results of high thermal conductivity and electromagnetic shielding composites are introduced, and the future development trend of new materials for microelectronic packaging is prospected.
 
Publisher PiscoMed Publishing Pte Ltd
 
Contributor
 
Date 2020-06-02
 
Type info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion

 
Format application/pdf
 
Identifier http://ojs.piscomed.com/index.php/MPC/article/view/846
10.18282/mpc.v1i4.846
 
Source Materials Physics and Chemistry; Vol 1, No 4: (Published); 18-23
2661-412X
 
Language eng
 
Relation http://ojs.piscomed.com/index.php/MPC/article/view/846/759
 
Rights Copyright (c) 2020 Materials Physics and Chemistry
http://creativecommons.org/licenses/by-nc/4.0
 

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